Hanoi, June 27, 2026 – The Europe Today: Vietnam has launched its first national semiconductor chip prototyping centre, marking a significant step in the country’s efforts to build a competitive domestic semiconductor industry and accelerate the commercialization of locally designed chips.
The Vietnam National Multi-Project Wafer Coordination Center (VNMPW/CC), established by the Ministry of Science and Technology, was officially inaugurated in Hanoi on Friday. The centre aims to connect Vietnamese chip designers with the global semiconductor manufacturing ecosystem while providing shared infrastructure for chip prototyping, testing and commercialization.
Speaking at the launch ceremony, Vũ Hải Quân said the initiative forms part of the government’s broader strategy to develop a comprehensive semiconductor ecosystem, supported by recent legal and policy reforms designed to promote the high-tech sector.
Vietnam currently lacks industrial-scale semiconductor fabrication facilities, requiring universities, research institutions and chip design companies to send prototype designs to overseas foundries. This process typically costs between US$30,000 and US$200,000 per design and can take between 12 and 24 months.
The new centre will operate under the Multi-Project Wafer (MPW) model, enabling multiple chip designs to share a single fabrication run. The approach is expected to significantly reduce development costs, shorten production timelines and accelerate the commercialization of “Make in Vietnam” semiconductor products.
According to the Ministry of Science and Technology, Vietnam is home to approximately 60 chip design companies, 7,000 chip design engineers and 166 universities offering semiconductor-related programmes. Initial registrations indicate demand for the prototyping of around 30,000 semiconductor chips.
The VNMPW/CC will support the entire semiconductor value chain, including design verification, prototyping, packaging, testing and technology transfer, while strengthening collaboration between domestic institutions and international manufacturing and technology partners.
Under the government’s semiconductor development roadmap, the State will fully subsidize chip prototyping costs during 2026 and 2027 to encourage participation from universities, research institutes and private companies. The centre will continue receiving government funding through 2030 as it expands its shared facilities and works toward becoming a leading semiconductor prototyping hub in Southeast Asia.
During the inauguration ceremony, the centre signed cooperation agreements with 19 domestic and international partners and established an advisory board comprising 21 semiconductor experts to support its long-term development.
